The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Nov. 28, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Yusuke Kawano, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/60 (2010.01); H01L 33/52 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light emitting device includes providing an insulating substrate having an electrically conductive member on a surface of the insulating substrate; after providing the insulating substrate, covering the electrically conductive member with a reflecting member by using electrodeposition or electrostatic coating; after covering the electrically conductive member with the reflecting member, insulating a portion of the electrically conductive member to form an insulating member; and singulating the substrate by cutting the substrate to form a plurality of singulated substrates, wherein the substrate is singulated such that, in each singulated substrate, the electrically conductive member is spaced apart from end portions of the singulated substrate.


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