The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Jan. 15, 2013
Koninklijke Philips N.v., Eindhoven, NL;
Serge Joel Armand Bierhuizen, San Jose, CA (US);
Koninklijke Philips N.V., Eindhoven, NL;
Abstract
A wafer-scale process is described that simultaneously encapsulates LED dies, forms lenses over the LED dies, and forms a chip scale package for said dies. An array of LED dies (A,B) are affixed to an adhesive surface of a temporary support structure (). The support structure is then brought against a mold (). A single molding material (), such as transparent silicone, then encapsulates the top and side surfaces of each LED die and forms a lens () over the top surface of each LED die. The molded material does not cover bottom surfaces of bottom electrodes () of the LED die so as to allow said electrodes to be directly bonded to pads () of a substrate (), such as a PCB. The temporary support substrate is then removed after the molding process, and the molded material is singulated to separate out the packages.