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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9368517 B1

PDFFull Text
Date of Patent:
Jun. 14, 2016

Filed:

Apr. 17, 2014

Semiconductor device including bonding portion with first and second sealing materials

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Takeshi Fukunaga, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., , JP;

Attorney:

Husch Blackwell LLP

Primary Examiner:

Sikha Roy

Int. Cl.
CPC ...
H05B 33/04 (2006.01); H05B 33/02 (2006.01); H01L 27/12 (2006.01); G01N 33/497 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 33/62 (2010.01); H01L 31/153 (2006.01); H05K 3/36 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G01N 33/497 (2013.01); H01L 27/329 (2013.01); H01L 27/3276 (2013.01); H01L 27/3279 (2013.01); H01L 27/3288 (2013.01); H01L 31/153 (2013.01); H01L 33/62 (2013.01); H01L 51/5203 (2013.01); H01L 51/524 (2013.01); H05K 1/0298 (2013.01); H05K 3/361 (2013.01); H01L 2251/5315 (2013.01); H01L 2924/0002 (2013.01); H05K 3/323 (2013.01); H05K 2201/093 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) () is provided facing a substrate (first substrate) () that has a luminous element () formed thereon. A PWB side wiring (second group of wirings) () on the printed wiring board () is electrically connected to element side wirings (first group of wirings) () by anisotropic conductive films (). At this point, because a low resistant copper foil is used to form the PWB side wiring (), a voltage drop of the element side wirings () and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

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