The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Nov. 25, 2013
Applicant:

Formosa Epitaxy Incorporation, Tao-Yuan Hsien, TW;

Inventors:

Chi-Chih Pu, Tao-Yuan Hsien, TW;

Chen-Hong Lee, Tao-Yuan Hsien, TW;

Tzu-Hsiang Wang, Tao-Yuan Hsien, TW;

Sheng-Hung Hsu, Tao-Yuan Hsien, TW;

Wei-Kang Cheng, Tao-Yuan Hsien, TW;

Shyi-Ming Pan, Tao-Yuan Hsien, TW;

Assignee:

Formosa Epitaxy Incorporation, Lung-Tan IND. Park, Lung-Tan, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2010.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); F21K 9/135 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 33/007 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83493 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.


Find Patent Forward Citations

Loading…