The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Feb. 12, 2015
Applicant:
SK Hynix Inc., Icheon, KR;
Inventor:
Hyeong Seok Choi, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/02175 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/17133 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06544 (2013.01);
Abstract
A semiconductor device includes a substrate having a first surface and a second surface that are opposite to each other, a plurality of through electrodes penetrating the substrate and extending from the first surface to the second surface, front-side bumps disposed on the first surface and connected to odd-numbered through electrodes among the plurality of through electrodes, and backside bumps disposed on the second surface and connected to even-numbered through electrodes among the plurality of through electrodes. Related semiconductor packages, fabrication methods, electronic systems and memory cards are also provided.