The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Apr. 29, 2015
Applicant:

Marvell World Trade Ltd., St. Michael, BB;

Inventor:

Albert Wu, Palo Alto, CA (US);

Assignee:

Marvell World Trade Ltd., St. Michael, BB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49558 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49568 (2013.01);
Abstract

Embodiments of the present disclosure provide a package comprising a die attach pad, a die disposed on the die attach pad and a leadframe. The leadframe includes an opening defined therein that exposes a bottom surface of the die attach pad. The leadframe comprises a plurality of bond pads that are exposed at a bottom surface of the leadframe and a plurality of traces that are exposed at the bottom surface of the leadframe. Each trace of the plurality of traces is coupled to a corresponding bond pad of the plurality of bond pads. At least some of the traces are coupled to the die at top surfaces of the at least some of the traces. The leadframe also comprises a plurality of first insulated barriers. Each first insulated barrier is located between (i) a corresponding trace and (ii) a corresponding bond pad coupled to the corresponding trace.


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