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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9368427 B1

PDFFull Text
Expired
Date of Patent:
Jun. 14, 2016

Filed:

Aug. 08, 2013

Integrated circuit film and method of manufacturing the same

Applicant:

Mxtran Inc., Hsin Chu, TW;

Inventors:

Chin-Sheng Lin, Zhubei, TW;

Cheng-Chia Kuo, Hsinchu, TW;

Chih-Cheng Lin, Hsinchu, TW;

Assignee:

MXTRAN INC., Hsin Chu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Telly Green

Int. Cl.
CPC ...
G06K 21/06 (2006.01); H01L 23/48 (2006.01); G06K 7/10 (2006.01); G06K 19/07 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); G06K 7/10237 (2013.01); G06K 7/10297 (2013.01); G06K 19/0727 (2013.01); H01L 23/49855 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/07811 (2013.01);
Abstract

An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads.

Find Patent Forward Citations

Lin, Chin-Sheng. (2016). Integrated circuit film and method of manufacturing the same (U.S. Patent No. 9368427). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9368427

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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