The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Feb. 25, 2014
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventor:
Heat Bit Park, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); H01L 25/065 (2006.01); G11C 29/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G11C 7/10 (2013.01); G11C 29/022 (2013.01); H01L 25/0657 (2013.01); G11C 7/1048 (2013.01); G11C 7/1096 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/17181 (2013.01);
Abstract
A semiconductor apparatus having a through via to be electrically coupled with a chip includes a latch memory cell configured to be electrically coupled with the through via and receive a signal transmitted through the through via, and output a stored signal to the through via.