The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Jun. 09, 2014
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Satoshi Inoue, Yokohama, JP;
Yuui Shimizu, Kawasaki, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G05F 3/02 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
G05F 3/02 (2013.01); H01L 23/488 (2013.01); H01L 2224/16 (2013.01);
Abstract
A semiconductor device comprises a plurality of semiconductor chips stacked on a substrate. The semiconductor chip comprises: an internal power supply voltage generating circuit that generates an internal power supply voltage based on an external power supply; a power supply line that supplies the internal power supply voltage; an internal power supply pad connected to the power supply line; and a stabilizing capacitance connected to the power supply line. The internal power supply pad is electrically short-circuited with the internal power supply pad included in another semiconductor chip.