The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Oct. 17, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jae Hyun Park, Seoul, KR;

Jun Seok An, Suwon-si, KR;

Yong Hun Kwon, Anyang-si, KR;

Nae Won Jang, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/0091 (2013.01); G02B 6/009 (2013.01); G02B 6/0088 (2013.01); G02B 6/0093 (2013.01); G02F 1/133608 (2013.01); G02B 6/0068 (2013.01); G02B 6/0073 (2013.01); G02B 6/0083 (2013.01);
Abstract

A LED module includes a printed circuit board, LEDs which are vertically mounted on the printed circuit board and which emit light onto a side surface, and a contact member which is provided to come into contact with a light guide plate. The printed circuit board may be movably coupled to a bottom chassis. When the light guide plate undergoes thermal expansion, the LED module may move by pressing of the light guide plate acting on the contact member. Accordingly, a gap between the light guide plate and the LEDs may be uniformly maintained even when the light guide plate undergoes thermal expansion or is returned to an original state.


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