The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Nov. 13, 2014
Applicants:

Brightek Optoelectronic (Shenzhen) Co., Ltd., Shenzhen, CN;

Brightek Optoelectronic Co., Ltd., Taoyuan County, TW;

Inventors:

Chien-Chung Huang, Taoyuan County, TW;

Chih-Ming Wu, Taoyuan County, TW;

Yi Hsun Chen, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 23/00 (2015.01); F21K 99/00 (2016.01); H01L 25/16 (2006.01); F21V 15/00 (2015.01); H05K 1/02 (2006.01); F21V 25/00 (2006.01); H01L 25/075 (2006.01); F21Y 101/02 (2006.01); F21Y 105/00 (2016.01); F21Y 113/00 (2016.01); F21V 29/507 (2015.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
F21V 23/005 (2013.01); F21K 9/00 (2013.01); F21K 9/30 (2013.01); F21V 15/00 (2013.01); H01L 25/167 (2013.01); H05K 1/0201 (2013.01); F21V 25/00 (2013.01); F21V 29/507 (2015.01); F21Y 2101/02 (2013.01); F21Y 2105/001 (2013.01); F21Y 2113/005 (2013.01); H01L 25/0753 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0216 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01);
Abstract

An LED base module includes a substrate and several driving units disposed on the substrate. Each driving unit includes a circuit layer, a separating wall, an LED driving component, a packaging member, and two electrodes. The circuit layer, the separating wall, and the electrodes are disposed on the substrate. A portion of the substrate corresponding to each driving unit is provided with an LED area and an electronic component area defined by the separating wall. The LED driving component is disposed on a portion of the circuit layer arranged in the electronic component area. The packaging member is formed on the electronic component area to entirely cover the LED driving component. A portion of the circuit layer arranged in the LED bonding area is used to bond to an LED chip, and the separating wall is configured to separate the LED chip and the LED driving component.


Find Patent Forward Citations

Loading…