The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
May. 23, 2012
Applicants:
Kirstin Petersen, Regensburg, DE;
Stephan Preuss, Bad Abbach, DE;
Markus Pindl, Tegernhelm, DE;
Markus Boss, Regensburg, DE;
Martin Brandl, Kelheim, DE;
Inventors:
Kirstin Petersen, Regensburg, DE;
Stephan Preuss, Bad Abbach, DE;
Markus Pindl, Tegernhelm, DE;
Markus Boss, Regensburg, DE;
Martin Brandl, Kelheim, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 9/16 (2006.01); F21K 99/00 (2016.01); H01L 33/50 (2010.01); B29D 11/00 (2006.01); B29C 43/02 (2006.01); H01L 33/58 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); B29C 43/20 (2006.01);
U.S. Cl.
CPC ...
F21K 9/50 (2013.01); B29C 43/021 (2013.01); B29D 11/0073 (2013.01); B29D 11/00807 (2013.01); H01L 24/97 (2013.01); H01L 33/50 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); B29C 43/20 (2013.01); H01L 25/0753 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01);
Abstract
An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method.