The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

May. 14, 2010
Applicants:

Shiro Torizuka, Ibaraki, JP;

Eijiro Muramatsu, Ibaraki, JP;

Takafumi Komatsu, Nagano, JP;

Hitoshi Kobayashi, Nagano, JP;

Shin-ichi Nagayama, Saitama, JP;

Mitsuyuki Tanaka, Saitama, JP;

Inventors:

Shiro Torizuka, Ibaraki, JP;

Eijiro Muramatsu, Ibaraki, JP;

Takafumi Komatsu, Nagano, JP;

Hitoshi Kobayashi, Nagano, JP;

Shin-ichi Nagayama, Saitama, JP;

Mitsuyuki Tanaka, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02M 61/18 (2006.01); B21D 28/16 (2006.01); B21D 35/00 (2006.01); C21D 6/00 (2006.01); C21D 7/02 (2006.01); F02B 23/10 (2006.01);
U.S. Cl.
CPC ...
F02M 61/1853 (2013.01); B21D 28/16 (2013.01); B21D 35/005 (2013.01); C21D 6/004 (2013.01); C21D 7/02 (2013.01); F02M 61/1813 (2013.01); C21D 2201/03 (2013.01); C21D 2211/005 (2013.01); C21D 2261/00 (2013.01); F02B 2023/103 (2013.01); F02M 2200/9053 (2013.01);
Abstract

An orifice plate for liquid injection made of plate-shaped stainless steel, wherein an orifice is formed by shearing, is characterized in that the average crystal grain size of the stainless steel is 3 μm or less. The thickness of the plate-shaped stainless steel is 1.2 mm or less, and preferably 0.1 mm or less. The aspect ratio of the orifices is 0.8 or lower. The orifices are formed orthogonal to the plate surface, or slanted by 50° or at smaller angles. The plate-shaped stainless steel has a composition containing C, Mn, and Si.


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