The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Mar. 31, 2014
Applicant:
Mitsubishi Gas Chemical Company, Inc., Chiyoda-ku, JP;
Inventors:
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C23F 1/26 (2006.01); C23F 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
C23F 1/26 (2013.01); C23F 1/18 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 3/061 (2013.01); H05K 3/067 (2013.01);
Abstract
The present invention provides a liquid composition used for etching a copper- and titanium-containing multilayer film, a method for etching a copper- and titanium-containing multilayer film by using said liquid composition, a method for manufacturing multilayer-film wiring according to said etching method, and a substrate provided with multilayer-film wiring manufactured according to said manufacturing method. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source and (C) a fluoride ion source and having the pH value of 0-7 is used.