The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Mar. 15, 2013
Applicant:
Mitsubishi Engineering-plastics Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 (2006.01); C08K 7/14 (2006.01); C08K 3/40 (2006.01); C08L 77/06 (2006.01); C23C 18/38 (2006.01); C23C 18/42 (2006.01); C23C 18/32 (2006.01); H05K 1/03 (2006.01); C08K 3/22 (2006.01); C08K 9/02 (2006.01); H05K 3/10 (2006.01); F21V 7/22 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C08L 101/12 (2006.01);
U.S. Cl.
CPC ...
C08K 3/00 (2013.01); C08K 3/22 (2013.01); C08K 3/2279 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08K 9/02 (2013.01); C08L 77/06 (2013.01); C08L 101/12 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/42 (2013.01); F21V 7/22 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01); C08K 2003/2231 (2013.01); C08K 2003/2241 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0221 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0254 (2013.01); H05K 2201/0293 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01);
Abstract
Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.