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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9365693 B1

PDFFull Text
Date of Patent:
Jun. 14, 2016

Filed:

Mar. 15, 2013

Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

Applicant:

Mitsubishi Engineering-plastics Corporation, Tokyo, JP;

Inventors:

Takahiro Takano, Hiratsuka, JP;

Takahiko Sumino, Hiratsuka, JP;

Kentarou Ishihara, Hiratsuka, JP;

Assignee:

MITSUBISHI ENGINEERING-PLASTICS CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C08K 3/00 (2006.01); C08K 7/14 (2006.01); C08K 3/40 (2006.01); C08L 77/06 (2006.01); C23C 18/38 (2006.01); C23C 18/42 (2006.01); C23C 18/32 (2006.01); H05K 1/03 (2006.01); C08K 3/22 (2006.01); C08K 9/02 (2006.01); H05K 3/10 (2006.01); F21V 7/22 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C08L 101/12 (2006.01);
U.S. Cl.
CPC ...
C08K 3/00 (2013.01); C08K 3/22 (2013.01); C08K 3/2279 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08K 9/02 (2013.01); C08L 77/06 (2013.01); C08L 101/12 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/42 (2013.01); F21V 7/22 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01); C08K 2003/2231 (2013.01); C08K 2003/2241 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0221 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0254 (2013.01); H05K 2201/0293 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01);
Abstract

Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Find Patent Forward Citations

Takano, Takahiro. (2016). Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer (U.S. Patent No. 9365693). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9365693

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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