The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Nov. 25, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Thomas Mayer, Reutlingen, DE;

Heribert Weber, Nuertingen, DE;

Jens Frey, Filderstadt, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81C 2203/0109 (2013.01);
Abstract

A method for manufacturing a micromechanical component includes the following sequential steps: a first material layer including a first joining partner being applied to a first wafer; a second material layer including a second joining partner being applied to a second wafer; a micromechanical structure being created in the first wafer by gas phase etching with the aid of a gaseous etching medium which is applied to the first joining partner; the first and second wafers being joined in such a way that they are in contact at least in some areas; and the first and second joining partners being heated to be integrally joined to form a connecting layer, a eutectic joining material being formed in the connecting layer from the first joining partner and the second joining partner.


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