The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Jul. 03, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hiroyuki Usui, Tochigi, JP;

Keisuke Aramaki, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 7/01 (2006.01); B29D 7/00 (2006.01); B06B 1/00 (2006.01); B29C 47/00 (2006.01); C08J 5/18 (2006.01); H01L 23/373 (2006.01); C08K 7/06 (2006.01); C08L 83/04 (2006.01); C08K 3/22 (2006.01); C08L 83/14 (2006.01); B26D 1/08 (2006.01); B26D 7/08 (2006.01); B26D 3/28 (2006.01); C08K 7/18 (2006.01); B29C 35/02 (2006.01); B29C 47/10 (2006.01); B29C 47/88 (2006.01); B29C 70/62 (2006.01); B29C 70/14 (2006.01); C08K 3/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 5/56 (2006.01); B29K 509/00 (2006.01); B29L 7/00 (2006.01); B29L 31/18 (2006.01);
U.S. Cl.
CPC ...
B29D 7/01 (2013.01); B26D 1/08 (2013.01); B26D 3/28 (2013.01); B26D 7/086 (2013.01); B29C 35/02 (2013.01); B29C 47/1027 (2013.01); B29C 47/8805 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 7/06 (2013.01); C08K 7/18 (2013.01); C08L 83/04 (2013.01); C08L 83/14 (2013.01); H01L 23/3737 (2013.01); B29C 47/0004 (2013.01); B29C 47/0021 (2013.01); B29C 47/0066 (2013.01); B29C 70/14 (2013.01); B29C 70/62 (2013.01); B29K 2509/00 (2013.01); B29K 2883/00 (2013.01); B29K 2995/0013 (2013.01); B29K 2995/0044 (2013.01); B29K 2995/0073 (2013.01); B29L 2007/00 (2013.01); B29L 2031/18 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 2383/04 (2013.01); C08J 2383/05 (2013.01); C08J 2383/07 (2013.01); C08K 3/04 (2013.01); C08K 5/56 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08L 2205/025 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/24488 (2015.01); Y10T 428/24777 (2015.01); Y10T 428/268 (2015.01);
Abstract

A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.


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