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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9364979 B1

PDFFull Text
Date of Patent:
Jun. 14, 2016

Filed:

Oct. 09, 2012

Molded structure body and method of producing the same

Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi-ken, JP;

Inventors:

Hideo Kamiya, Hekinan, JP;

Hideki Nakamura, Toyota, JP;

Yuuta Yamanobe, Toyota, JP;

Assignee:

TOYOTA BOSHOKU KABUSHIKI KAISHA, Aichi, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Catherine A Simone

Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 5/14 (2006.01); B29C 45/14 (2006.01); B29C 69/02 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1418 (2013.01); B29C 45/14262 (2013.01); B29C 45/14311 (2013.01); B29C 45/14786 (2013.01); B29C 69/02 (2013.01); B29C 2045/14188 (2013.01); B29C 2045/14286 (2013.01); B29L 2031/3014 (2013.01); Y10T 428/24595 (2015.01); Y10T 428/31797 (2015.04); Y10T 428/31909 (2015.04);
Abstract

A molded structure body includes a base member including at least thermoplastic resin and a molded member. The base member includes a connection portion, a first surrounding portion provided close to the connection portion and having a first density, and a second surrounding portion provided close to the first surrounding portion and having a second density. The first density is higher than the second density. The molded member is connected to and molded with the base member by injection of melted resin to the base member, and the molded member is connected to the connection portion.

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Quick Actions:

Kamiya, Hideo. (2016). Molded structure body and method of producing the same (U.S. Patent No. 9364979). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9364979

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