The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Apr. 17, 2014
Applicant:
United Technologies Corporation, Hartford, CT (US);
Inventors:
John McBrien, South Glastonbury, CT (US);
Lea Kennard Castle, Vernon, CT (US);
Brandon W. Spangler, Vernon, CT (US);
JinQuan Xu, East Greenwich, RI (US);
Assignee:
United Technologies Corporation, Hartford, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22C 7/02 (2006.01); B22D 23/06 (2006.01); F01D 5/28 (2006.01); F01D 5/18 (2006.01); B22F 3/105 (2006.01); B22F 5/04 (2006.01); C30B 11/00 (2006.01); C30B 29/52 (2006.01); B22C 9/04 (2006.01); B22C 9/02 (2006.01); B22C 9/10 (2006.01); B22C 9/22 (2006.01); B23K 15/00 (2006.01); B32B 1/08 (2006.01); B32B 3/08 (2006.01); B32B 3/26 (2006.01); B32B 5/16 (2006.01); B32B 9/00 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22C 7/02 (2013.01); B22C 9/02 (2013.01); B22C 9/043 (2013.01); B22C 9/10 (2013.01); B22C 9/22 (2013.01); B22D 23/06 (2013.01); B22F 3/1055 (2013.01); B22F 5/04 (2013.01); B23K 15/0006 (2013.01); B23K 26/342 (2015.10); B32B 1/08 (2013.01); B32B 3/08 (2013.01); B32B 3/26 (2013.01); B32B 5/16 (2013.01); B32B 9/005 (2013.01); C30B 11/00 (2013.01); C30B 29/52 (2013.01); F01D 5/18 (2013.01); F01D 5/28 (2013.01); B32B 2250/03 (2013.01); B32B 2264/105 (2013.01); B32B 2603/00 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F05D 2230/31 (2013.01); Y02P 10/295 (2015.11);
Abstract
One embodiment includes a method to regenerate a component. The method includes additively manufacturing the component with at least a portion of the component in a near finished shape. The component is encased in a shell mold, the shell mold is cured, the encased component is placed in a furnace and the component is melted, the component is solidified in the shell mold, and the shell mold is removed from the solidified component.