The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Mar. 15, 2013
Applicant:

Ufptechnologies, Inc., Georgetown, MS (US);

Inventors:

Gregory Kennedy, San Buenaventura, CA (US);

David Stewart, El Paso, TX (US);

Maura Galligan, West Newbury, MA (US);

Assignee:

UFP TECHNOLOGIES, INC., Georgetown, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A01C 1/04 (2006.01); B32B 38/10 (2006.01); A01G 9/10 (2006.01); A01G 9/02 (2006.01);
U.S. Cl.
CPC ...
A01C 1/044 (2013.01); A01G 9/026 (2013.01); A01G 9/10 (2013.01); B32B 38/10 (2013.01);
Abstract

A method of forming a plantable structure involves providing a substrate element, a release layer spaced from the substrate element, an adhesive layer disposed between the substrate element and the release layer, and at least one seed abutting the adhesive layer. The seed(s) is/are coupled to the substrate element through the adhesive layer. The method further comprises removing the release layer from the composite article, and adhering a remaining portion of the composite article to a secondary article. The remaining portion of the secondary article comprises the substrate element, the adhesive layer disposed on the substrate element, and the seed(s) abutting the adhesive layer. Also disclosed herein are a method of planting at least one seed with a composite article, a packaging structure, a method of forming a packaging structure, and a method of planting at least one seed.


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