The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jan. 14, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yasuhiro Nishisaka, Nagaokakyo, JP;

Yukio Sanada, Nagaokakyo, JP;

Koji Sato, Nagaokakyo, JP;

Seiichi Matsumoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01C 7/00 (2006.01); H01F 27/28 (2006.01); H01L 41/083 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H01C 7/008 (2013.01); H01F 27/2804 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01L 41/083 (2013.01);
Abstract

A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.


Find Patent Forward Citations

Loading…