The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Sep. 15, 2011
Takashi Shibasaki, Gunma, JP;
Hidefumi Saito, Isesaki, JP;
Takahisa Makino, Kiryu, JP;
Masanori Shimizu, Ashikaga, JP;
Daisuke Sasaki, Ota, JP;
Takashi Shibasaki, Gunma, JP;
Hidefumi Saito, Isesaki, JP;
Takahisa Makino, Kiryu, JP;
Masanori Shimizu, Ashikaga, JP;
Daisuke Sasaki, Ota, JP;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device () is provided with: a circuit board (); a plurality of ceramic substrates (A-G) disposed on the top surface of the circuit board (); circuit elements such as transistors mounted on the top surface of the ceramic substrates (A-G); and a lead () or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (A-C) are disposed superimposed in the vicinity of the center of the circuit board (), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (A, etc.).