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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9363893 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Apr. 20, 2012

Printed circuit board arrangement comprising an oscillatory system

Applicant:

Uwe Hansen, Tuebingen, DE;

Inventor:

Uwe Hansen, Tuebingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:

Michael Best & Friedrich LLP

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 5/00 (2006.01); G01L 19/06 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); G01P 15/08 (2006.01); G01P 15/09 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
H05K 1/148 (2013.01); G01L 19/06 (2013.01); G01P 15/0802 (2013.01); H05K 1/14 (2013.01); H05K 1/141 (2013.01); H05K 1/142 (2013.01); H05K 1/144 (2013.01); H05K 5/0056 (2013.01); G01P 15/09 (2013.01); G01P 15/125 (2013.01); G01P 2015/0882 (2013.01); H05K 1/0271 (2013.01); H05K 1/145 (2013.01); H05K 3/0064 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10151 (2013.01);
Abstract

The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

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