The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Dec. 16, 2011
Kazuyuki Ohmori, Saijo, JP;
Tatsuya Sunamoto, Saijo, JP;
Kazuyuki Ohmori, Saijo, JP;
Tatsuya Sunamoto, Saijo, JP;
KURARAY CO., LTD., Kurashiki-shi, JP;
Abstract
Provided is a method of manufacturing a circuit board including preparing a board structural body () and covering a conductor circuit element () on an outermost layer of the board structural body () with a cover film (), wherein a heat treatment is performed while having a release material () interposed between the cover film () and a heat-processing device. The release material () is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film () selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (), a first high-density polyethylene film (), a second high-density polyethylene film (), and a second aluminum foil (). The first high-density polyethylene film () and the second high-density polyethylene film () are positioned such that respective MD directions are perpendicular to each other.