The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Dec. 23, 2011
Applicants:
Sung Wuk Ryu, Seoul, KR;
Seong BO Shim, Seoul, KR;
Seung Yul Shin, Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 3/40 (2013.01); H05K 3/4007 (2013.01); H05K 3/3436 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0367 (2013.01);
Abstract
A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.