The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Dec. 15, 2010
Takashi Sekine, Hamamatsu, JP;
Toshiyuki Kawashima, Hamamatsu, JP;
Hirofumi Kan, Hamamatsu, JP;
Yoneyoshi Kitagawa, Hamamatsu, JP;
Yoshitaka Mori, Hamamatsu, JP;
Hirozumi Azuma, Seto, JP;
Tatsumi Hioki, Nagoya, JP;
Tomoyoshi Motohiro, Seto, JP;
Yasushi Miyamoto, Toyota, JP;
Naoki Nakamura, Toyota, JP;
Takashi Sekine, Hamamatsu, JP;
Toshiyuki Kawashima, Hamamatsu, JP;
Hirofumi Kan, Hamamatsu, JP;
Yoneyoshi Kitagawa, Hamamatsu, JP;
Yoshitaka Mori, Hamamatsu, JP;
Hirozumi Azuma, Seto, JP;
Tatsumi Hioki, Nagoya, JP;
Tomoyoshi Motohiro, Seto, JP;
Yasushi Miyamoto, Toyota, JP;
Naoki Nakamura, Toyota, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi, JP;
Abstract
An object is to be capable of inducing a nuclear fusion reaction at a relatively high efficiency and downsize a device. A nuclear fusion deviceof the present invention includes a nuclear fusion targetincluding a target substratecontaining deuterium or tritium and a thin-film layercontaining deuterium or tritium stacked on the target substrate, a vacuum containerfor storing the nuclear fusion target, and a laser unitfor irradiating two successive first and second pulsed laser lights P, Ptoward the thin-film layerof the nuclear fusion target, and the intensity of the first pulsed laser light Pis set to a value that is smaller than that of the second pulsed laser light Pand allows peeling of the thin-film layerfrom the target substrate