The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Aug. 12, 2014
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

John Dunaway Charlton, Harrisburg, PA (US);

Khalil John Maalouf, Chambersburg, PA (US);

David Michael Stull, Etters, PA (US);

Charles David Fry, New Bloomfield, PA (US);

Keith Lynn Nicholas, Harrisburg, PA (US);

Assignee:

TYCO ELECTRONICS CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H01R 43/042 (2006.01); H01R 43/048 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0488 (2013.01); Y10T 29/53235 (2015.01);
Abstract

A terminal crimping device includes crimp tooling defining a crimp zone configured to receive a wire and a terminal. The terminal is configured to be crimped to the wire by the tooling during a crimp stroke of the crimp tooling to form a crimped terminal. The crimp tooling includes an ultrasound module ultrasonically coupled to the crimp tooling and the wire and the crimped terminal when present. The ultrasound module transmits acoustic signals through the crimped terminal and the wire. The ultrasound module also receives echo acoustic signals being reflected back to the ultrasound module. The ultrasound module generates echo signals based on the echo acoustic signals. The terminal crimping device also includes a crimp quality module that receives the echo signals from the ultrasound module and determines a crimp height of the crimped terminal based on the reflected echo acoustic signals received by the ultrasound module.


Find Patent Forward Citations

Loading…