The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Feb. 19, 2014
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 24/85 (2013.01); H01L 51/5237 (2013.01); H01L 24/45 (2013.01); H01L 51/5203 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85375 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/20301 (2013.01); H01L 2924/20302 (2013.01); H01L 2924/20303 (2013.01); H01L 2924/20304 (2013.01);
Abstract

Disclosed is a method for contacting a device with a conductor, the devicecomprising a substratewith at least one cell, a contact regionand an encapsulation, wherein the encapsulationencapsulates at least the contact region, the method comprising the steps of arranging the conductoron the encapsulation, and interconnecting the conductorwith the contact regionwithout removing the encapsulationbetween the conductorand the contact regionbeforehand. This invention is advantageous as the encapsulationbetween the conductorand the contact regiondoes not need to be removed beforehand anymore.


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