The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jul. 22, 2014
Applicant:
Wai Yew Lo, Petaling Jaya, MY;
Inventor:
Wai Yew Lo, Petaling Jaya, MY;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); H01L 41/113 (2006.01); H01L 41/23 (2013.01); H01L 41/25 (2013.01); H01L 41/053 (2006.01); H01L 41/04 (2006.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); H01L 41/042 (2013.01); H01L 41/0533 (2013.01); H01L 41/23 (2013.01); H01L 41/25 (2013.01);
Abstract
A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.