The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Mar. 10, 2015
Chiung-cheng Lo, Miaoli, TW;
Yu-fu Kang, Taipei, TW;
Ning-yuan Wang, New Taipei, TW;
Chiung-wen Lin, Changhua, TW;
Chiung-Cheng Lo, Miaoli, TW;
Yu-Fu Kang, Taipei, TW;
Ning-Yuan Wang, New Taipei, TW;
Chiung-Wen Lin, Changhua, TW;
RICHTEK TECHNOLOGY CORPORATION R.O.C., Hsinchu, TW;
Abstract
The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.