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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9362242 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Apr. 08, 2014

Bonding structure including metal nano particle

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Aya Iwata, Tokyo, JP;

Yasunari Hino, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 23/482 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/367 (2013.01); H01L 23/4827 (2013.01); H01L 24/03 (2013.01); H01L 24/83 (2013.01); H01L 29/1608 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0383 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83365 (2013.01); H01L 2224/83385 (2013.01); H01L 2251/5369 (2013.01);
Abstract

A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 μm to 2.0 μm.

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