The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Nov. 13, 2015
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Ward G. Fillmore, Hudson, MA (US);

Paul J. Duval, Lexington, MA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 21/764 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/7682 (2013.01); H01L 23/4821 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A substrate having an air bridge structure with end portions disposed and supported on the substrate and an elevated portion disposed between the end portions is coated with a protective layer. The protective layer is patterned to: leave portions of the protective layer over elevated portion and at least over the end portions of a region under the elevated portion of the air bridge structure; and remove portions over adjacent portions of the substrate. A dielectric material having a thickness greater than the height of the air bridge structure is deposited over the patterned protective layer portions remaining over elevated portion and over the adjacent portions of the substrate, the patterned temporary coating preventing the dielectric material from passing into the region under the elevated portion of the air bridge structure. The dielectric material is patterned to remove portions of the dielectric material over the patterned protective layer remaining over elevated portion while leaving the dielectric material over the adjacent portions of the substrate. The patterned protective layer portions remaining over elevated portion are removed while leaving the dielectric material over the adjacent portions of the substrate.


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