The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Apr. 16, 2015
Applicant:

International Rectifier Corporation, El Segundo, CA (US);

Inventors:

Mark Pavier, Felbridge, GB;

Daniel Cutler, Betchworth, GB;

Scott Palmer, Brighton, GB;

Clive O'Dell, Surrey, GB;

Rupert Burbidge, Surrey, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 27/00 (2006.01); H01L 23/522 (2006.01); H01L 29/739 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/522 (2013.01); H01L 23/49811 (2013.01); H01L 25/072 (2013.01); H01L 27/0647 (2013.01); H01L 29/7393 (2013.01); H01L 2924/0002 (2013.01);
Abstract

According to an exemplary implementation, a power component includes a component substrate and a power semiconductor device electrically and mechanically coupled to the component substrate. The power component also includes at least one first peripheral contact and at least one second peripheral contact situated on the component substrate. A power semiconductor device is situated between the at least one first peripheral contact and the at least one second peripheral contact. The at least one first peripheral contact, the at least one second peripheral contact, and a surface electrode of the power semiconductor device are configured for surface mounting. The at least one first peripheral contact can be electrically coupled to the power semiconductor device.


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