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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9362219 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

May. 09, 2013

Semiconductor module and semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tatsuya Kawase, Tokyo, JP;

Mikio Ishihara, Tokyo, JP;

Noboru Miyamoto, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 23/473 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 21/4871 (2013.01); H01L 23/053 (2013.01); H01L 23/3107 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/473 (2013.01); H01L 25/072 (2013.01); H01L 23/4006 (2013.01); H01L 24/40 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/41175 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/181 (2013.01);
Abstract

A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.

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