The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jun. 30, 2014
Seiko Instruments Inc., Chiba-shi, Chiba, JP;
Koji Tsukagoshi, Chiba, JP;
Sadao Oku, Chiba, JP;
Hiroyuki Fujita, Chiba, JP;
Keiichiro Hayashi, Chiba, JP;
Masaru Akino, Chiba, JP;
Abstract
Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member () including a hollow portion () having an inner bottom surface on which a semiconductor chip () is mounted, a surrounding portion () that surrounds the hollow portion (), and a bottom surface portion (); an inner lead (); and an outer lead () exposed from the resin molded member (). The inner lead buried in the molded member () includes an L-shaped lead extending portion having a through hole formed therethrough.