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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9362192 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Jun. 10, 2014

Semiconductor device comprising heat dissipating connector

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Hajime Takagi, Kanazawa, JP;

Takeshi Miyakawa, Kanazawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

White & Case LLP

Primary Examiner:

John C Ingham

Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/28 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 23/49568 (2013.01); H01L 23/564 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/4103 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.

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