The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Dec. 23, 2014
Applicant:
Nichia Corporation, Anan-shi, JP;
Inventors:
Shuji Shioji, Komatsushima, JP;
Masafumi Kuramoto, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 23/15 (2006.01); H01L 29/41 (2006.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 29/41 (2013.01); H01L 33/46 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/49113 (2013.01);
Abstract
To provide a semiconductor element that can have the high adhesion between a substrate made of an oxide or the like and a metal film, a semiconductor element includes a substrate made of an oxide, a semiconductor element structure provided on an upper surface of the substrate, and a metal film provided on a lower surface of the substrate, in which the metal film contains nanoparticles made of an oxide.