The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jun. 26, 2012
Applicants:

Thorsten Meyer, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Markus Brunnbauer, Lappersdorf, DE;

Assignee:

INTEL DEUTSCHLAND GMBH, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract

A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer.


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