The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jul. 23, 2013
Applicant:

General Cable Technologies Corporation, Highland Heights, KY (US);

Inventors:

Robert D. Kenny, Cincinnati, OH (US);

David M. Fausz, Fort Thomas, KY (US);

David P. Camp, II, Florence, KY (US);

Assignee:

General Cable Technologies Corporation, Highland Heights, KY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/24 (2006.01); H01B 13/18 (2006.01); H01B 11/18 (2006.01); H01B 11/10 (2006.01); H01B 13/14 (2006.01); B29C 47/02 (2006.01); B29C 47/06 (2006.01); B29C 47/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01B 13/24 (2013.01); H01B 11/1008 (2013.01); H01B 11/1856 (2013.01); H01B 11/1869 (2013.01); H01B 13/141 (2013.01); H01B 13/18 (2013.01); B29C 47/0014 (2013.01); B29C 47/0016 (2013.01); B29C 47/025 (2013.01); B29C 47/065 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3462 (2013.01);
Abstract

A method for making a cable jacket that includes the steps of providing at least one shielding tape having a substrate formed of a substrate material, said substrate including at least one conductive segment; inserting the at least one shielding tape between first and second jacket layers of the cable jacket, each of said first and second jacket layers being formed of a jacket material; and co-extruding the at least one shielding tape with the first and second jacket layers, wherein the substrate material of the at least one shielding tape and the jacket material of the first and second jacket layers are the same such that during the co-extrusion step, the substrate and first and second jacket layers bond together into a single layer wherein the at least one conductive segment is embedded in the single layer.


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