The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Feb. 13, 2015
Wireless bus for intra-chip and inter-chip communication, including embodiments with adaptable links
Broadcom Corporation, Irvine, CA (US);
Ahmadreza (Reza) Rofougaran, Newport Coast, CA (US);
Arya Reza Behzad, Poway, CA (US);
Sam Ziqum Zhao, Irvine, CA (US);
Jesus Alfonso Castaneda, Los Angeles, CA (US);
Michael Boers, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.