The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Apr. 09, 2012
Applicants:

Aruna Zhamu, Centerville, OH (US);

Mingchao Wang, Fairbone, OH (US);

Wei Xiong, Dayton, OH (US);

Bor Z. Jang, Centerville, OH (US);

Inventors:

Aruna Zhamu, Centerville, OH (US);

Mingchao Wang, Fairbone, OH (US);

Wei Xiong, Dayton, OH (US);

Bor Z. Jang, Centerville, OH (US);

Assignee:

Nanotek Instruments, Inc., Dayton, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 31/04 (2006.01); G06F 1/20 (2006.01); H01L 23/373 (2006.01); C04B 35/52 (2006.01); C04B 35/532 (2006.01); C04B 35/622 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 31/0438 (2013.01); C01B 31/0469 (2013.01); C01B 31/0476 (2013.01); C04B 35/522 (2013.01); C04B 35/532 (2013.01); C04B 35/62218 (2013.01); H01L 23/373 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/9607 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed is a graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer comprises at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source.


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