The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Sep. 18, 2012
Applicants:

Citizen Holdings Co., Ltd., Tokyo, JP;

Citizen Electronics Co., Ltd., Yamanashi, JP;

Inventors:

Sadato Imai, Yamanashi, JP;

Hirohiko Ishii, Yamanashi, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2010.01); F21V 29/00 (2015.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H05K 3/32 (2006.01); F21V 29/51 (2015.01); H01L 33/58 (2010.01); F21V 3/00 (2015.01); F21Y 101/02 (2006.01); F21Y 111/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/1355 (2013.01); F21K 9/50 (2013.01); F21V 29/006 (2013.01); F21V 29/51 (2015.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/64 (2013.01); H05K 3/32 (2013.01); F21K 9/135 (2013.01); F21V 3/00 (2013.01); F21Y 2101/02 (2013.01); F21Y 2111/001 (2013.01); H01L 33/58 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10962 (2013.01);
Abstract

Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.


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