The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jun. 26, 2015
Applicant:

Seoul Semiconductor Co., Ltd., Ansan-si, KR;

Inventor:

Sung Ho Jin, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2016.01); F21V 7/22 (2006.01); F21V 13/02 (2006.01); F21V 3/04 (2006.01); F21V 29/70 (2015.01); F21V 29/74 (2015.01); F21V 29/50 (2015.01); F21Y 105/00 (2016.01); F21V 3/00 (2015.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21K 9/135 (2013.01); F21K 9/1355 (2013.01); F21K 9/50 (2013.01); F21K 9/56 (2013.01); F21V 3/0481 (2013.01); F21V 7/22 (2013.01); F21V 13/02 (2013.01); F21V 29/70 (2015.01); F21V 29/74 (2015.01); F21V 3/00 (2013.01); F21V 29/50 (2015.01); F21Y 2101/02 (2013.01); F21Y 2105/001 (2013.01);
Abstract

An exemplary embodiment discloses a light-emitting diode (LED) lamp including a heat sink including a first surface and a second surface, and a substrate including a first surface and a second surface. The substrate disposed on the heat sink and the first surface of the heat sink contacts the second surface of the substrate. The LED lamp also includes at least one first LED disposed on the first surface of the substrate and a transparent cover connected to the heat sink and spaced apart from the substrate. The second surface of the heat sink is adjacent to the first surface of the heat sink. The second surface of the heat sink extends toward the transparent cover. At the least an end point of the second surface of the heat sink is disposed over an outer region of edges of the substrate.


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