The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jan. 23, 2014
Applicant:

Varel Europe S.a.s., Pau, FR;

Inventors:

Gary M. Thigpen, Houston, TX (US);

Federico Bellin, Tomball, TX (US);

Marvin Windsor Amundsen, Houston, TX (US);

Olivier Ther, Paris, FR;

Alfazazi Dourfaye, Paris, FR;

Bruno Cuillier De Maindreville, Pau, FR;

Williams Gomez, Bazet, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/54 (2006.01); E21B 10/42 (2006.01); B22D 19/06 (2006.01); B22F 7/08 (2006.01); C22C 29/08 (2006.01); E21B 10/00 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
E21B 10/42 (2013.01); B22D 19/06 (2013.01); B22F 7/08 (2013.01); C22C 29/08 (2013.01); E21B 10/00 (2013.01); B22F 2005/001 (2013.01);
Abstract

An apparatus and method for manufacturing a downhole tool that reduces failures occurring along a bondline between a cemented matrix coupled around a blank. The cemented matrix material is formed from a tungsten carbide powder, a shoulder powder, and a binder material, wherein at least one of the tungsten carbide powder or the shoulder powder is absent of any free tungsten. The blank, which optionally may be coated, is substantially cylindrically shaped and defines a channel extending from a top portion and through a bottom portion of the blank. The absence of free tungsten from at least one of the tungsten carbide powder or the shoulder powder reduces the reaction with iron from the blank, thereby allowing the control and reduction of intermetallic compounds thickness within the bondline.


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