The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Feb. 28, 2013
Applicant:

Element Six Technologies Us Corporation, Santa Clara, CA (US);

Inventors:

Daniel Francis, Oakland, CA (US);

Firooz Faili, Los Gatos, CA (US);

Kristopher Matthews, San Francisco, CA (US);

Frank Yantis Lowe, Phoenix, AZ (US);

Quentin Diduck, Ithaca, NY (US);

Sergey Zaytsev, Albany, CA (US);

Felix Ejeckam, San Francisco, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 25/16 (2006.01); C30B 25/10 (2006.01); C30B 25/18 (2006.01); C30B 25/20 (2006.01); C30B 29/04 (2006.01); H01L 21/02 (2006.01); C23C 16/27 (2006.01); C23C 16/46 (2006.01); H01L 29/20 (2006.01); H01L 29/778 (2006.01); H01L 21/18 (2006.01);
U.S. Cl.
CPC ...
C30B 25/16 (2013.01); C23C 16/271 (2013.01); C23C 16/463 (2013.01); C30B 25/10 (2013.01); C30B 25/18 (2013.01); C30B 25/183 (2013.01); C30B 25/205 (2013.01); C30B 29/04 (2013.01); H01L 21/0245 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02389 (2013.01); H01L 21/02488 (2013.01); H01L 21/02527 (2013.01); H01L 21/02658 (2013.01); H01L 21/187 (2013.01); H01L 29/2003 (2013.01); H01L 29/7786 (2013.01);
Abstract

A method for integrating wide-gap semiconductors, and specifically, gallium nitride epilayers, with synthetic diamond substrates is disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure that comprises at least one layer of gallium nitride. Methods for manufacturing GaN-on-diamond wafers with low bow and high crystalline quality are disclosed along with preferred choices for manufacturing GaN-on-diamond wafers and chips tailored to specific applications.


Find Patent Forward Citations

Loading…