The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Aug. 24, 2010
Applicants:

Nobuyuki Kobayashi, Tokyo, JP;

Takanori Sannan, Tokyo, JP;

Shinya Tsuchida, Tokyo, JP;

Yoshihiko Iijima, Tokyo, JP;

Inventors:

Nobuyuki Kobayashi, Tokyo, JP;

Takanori Sannan, Tokyo, JP;

Shinya Tsuchida, Tokyo, JP;

Yoshihiko Iijima, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/02 (2006.01); C09D 5/24 (2006.01); H01G 11/38 (2013.01); H01M 4/04 (2006.01); H01M 4/13 (2010.01); H01M 4/139 (2010.01); H01M 4/62 (2006.01); H01M 4/66 (2006.01); C09D 101/28 (2006.01); C09D 103/08 (2006.01); C09D 105/04 (2006.01); C09D 105/08 (2006.01); C08L 1/28 (2006.01); C08L 3/08 (2006.01); C08L 5/04 (2006.01); C08L 5/08 (2006.01); H01G 11/26 (2013.01); H01G 11/28 (2013.01); H01M 4/583 (2010.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08L 1/284 (2013.01); C08L 1/286 (2013.01); C08L 3/08 (2013.01); C08L 5/04 (2013.01); C08L 5/08 (2013.01); C09D 101/284 (2013.01); C09D 101/286 (2013.01); C09D 103/08 (2013.01); C09D 105/04 (2013.01); C09D 105/08 (2013.01); H01G 11/26 (2013.01); H01G 11/28 (2013.01); H01G 11/38 (2013.01); H01M 4/0404 (2013.01); H01M 4/13 (2013.01); H01M 4/139 (2013.01); H01M 4/622 (2013.01); H01M 4/667 (2013.01); H01M 4/583 (2013.01); H01M 4/625 (2013.01); H01M 10/0525 (2013.01); Y02E 60/122 (2013.01); Y02E 60/13 (2013.01); Y02P 70/54 (2015.11); Y10T 428/2913 (2015.01); Y10T 428/31678 (2015.04); Y10T 428/31971 (2015.04); Y10T 428/31975 (2015.04); Y10T 442/20 (2015.04);
Abstract

A water-based, carbon filler-dispersed coating formulation for forming a conductive coating film contains (1) a hydroxyalkyl chitosan as a resin binder, (2) a conductive carbon filler, and (3) a polybasic acid or its derivative in a water-based medium containing at least water as a polar solvent. In 100 parts by mass of the coating formulation, the hydroxyalkyl chitosan (1) is contained in a range of from 0.1 to 20 parts by mass, and the conductive carbon filler (2) is contained in a range of from 1 to 30 parts by mass. An electricity-imparting material, an electrode plate for an electricity storage device, a process for producing the electrode plate, and the electricity storage device are also disclosed.


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