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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9358763 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Jul. 13, 2012

Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus

Applicant:

Hiroyuki Kurimura, Shibukawa, JP;

Inventor:

Hiroyuki Kurimura, Shibukawa, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Stein IP, LLC

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 7/12 (2006.01); C09D 4/00 (2006.01); B32B 37/00 (2006.01); C09J 5/00 (2006.01); C09D 133/06 (2006.01); C09D 133/14 (2006.01); B32B 7/06 (2006.01); B32B 17/10 (2006.01); C08F 220/18 (2006.01); C08F 222/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 17/10045 (2013.01); B32B 17/1099 (2013.01); B32B 17/10706 (2013.01); B32B 37/00 (2013.01); B32B 37/0076 (2013.01); B32B 37/12 (2013.01); C09D 4/00 (2013.01); C09D 133/06 (2013.01); C09D 133/066 (2013.01); C09D 133/14 (2013.01); C09J 5/00 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/05 (2013.01); B32B 2307/414 (2013.01); B32B 2310/0837 (2013.01); B32B 2315/08 (2013.01); C08F 220/18 (2013.01); C08F 222/1006 (2013.01); C08L 2312/06 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1153 (2015.01);
Abstract

Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.

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