The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Jan. 22, 2008
Applicants:

Tatsuya Nakagawa, Matsudo, JP;

Takashi Tamura, Kumagaya, JP;

Inventors:

Tatsuya Nakagawa, Matsudo, JP;

Takashi Tamura, Kumagaya, JP;

Assignee:

Excell Corporation, Chiba-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16L 41/08 (2006.01); B29C 49/20 (2006.01); B29C 49/04 (2006.01); B29L 23/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 49/20 (2013.01); B29C 49/04 (2013.01); B29C 2049/2017 (2013.01); B29C 2049/2043 (2013.01); B29C 2049/2069 (2013.01); B29L 2023/004 (2013.01); B29L 2031/3005 (2013.01);
Abstract

An improved structure for sealing a through-hole formed in a plastic hollow product when mounting a component such as a sensor on the product is provided. A cylindrical section is provided in a peripheral wall of the plastic hollow product as projecting radially outwardly from the peripheral wall and an inner circumferential surface of the cylindrical section defines the through-hole for communication between the interior and the exterior of the product. A sensor component is mounted with its sensor portion extending through the through-hole and an O-ring is disposed between the sensor portion and the inner circumferential surface of the cylindrical section which is backed by a component mounting member.


Find Patent Forward Citations

Loading…