The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jul. 29, 2013
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Brian L. Carlson, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
Joseph Kuczynski, Rochester, MN (US);
Jeffrey A. Taylor, Rochester, MN (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 35/00 (2006.01); B23Q 11/10 (2006.01); B23Q 11/12 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
B23B 35/00 (2013.01); H05K 3/0047 (2013.01); B23B 2226/61 (2013.01); B23B 2228/36 (2013.01); B23B 2250/12 (2013.01); B23Q 11/10 (2013.01); B23Q 11/12 (2013.01); H05K 1/034 (2013.01); H05K 3/0008 (2013.01); H05K 3/0088 (2013.01); H05K 3/4676 (2013.01); H05K 2201/015 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/127 (2013.01); H05K 2203/166 (2013.01); Y10T 408/03 (2015.01); Y10T 408/44 (2015.01);
Abstract
A method is provided for implementing reduction of drill smear in drilling a multilayer substrate such as a rigid printed circuit board or flex to minimize or eliminate the need to remove drill smear and for improved via and interconnect reliability. An inert liquid is applied to the multilayer substrate and a drill bit prior to and during the drill process to cool and lubricate the multilayer substrate and the drill bit to reduce drill smear.