The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Mar. 04, 2013
Applicants:
Leijie Zhou, Tokyo, JP;
Hiroyuki Okabe, Tokyo, JP;
Inventors:
Leijie Zhou, Tokyo, JP;
Hiroyuki Okabe, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/049 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01L 23/049 (2013.01); H01L 23/40 (2013.01); H01L 25/072 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic member having one end engaging with the case and an opposite end in abutting contact with the heat sink. The elastic member forms a gap between the case and the heat sink, and heat conductive grease is appliable to the gap to be interposed between the case and the heat sink.